The Sonoco Institute of Packaging Design and Graphics at Clemson University

December Newsletter 2018

Happy holidays from the Sonoco Institute! In our December newsletter, read all about our latest partnerships with X-Rite and Siegwerk as well as a glimpse into end-of-semester capstone projects for packaging seniors, a spotlight on graduate Graphic Communications student, Himanshu Rana, a lineup of our spring industry events and more!           […]

November Newsletter 2018

Read more about the following topics in our November newsletter! One Clemson packaging student was awarded a PACK EXPO scholarship #GivingTuesday is coming November 27 – find out how you can support a graduate student! In case you missed it… Clemson’s PACK EXPO experience Print trials and upcoming training courses at the Sonoco Institute A […]

Student awarded PACK EXPO Scholarship

It was announced at PACK EXPO International in Chicago last month, that one of Clemson’s Packaging Science students, Ray Cummings, has been awarded a $5,000 scholarship from PMMI (The Association for Packaging and Processing Technologies). PMMI held their annual PACK gives BACK™ networking reception at PACK EXPO International, a large trade show attended by Clemson University […]

CU packaging group returns from PackExpo International

Clemson University’s packaging division was highly involved in this year’s PackExpo International show at McCormick Place in Chicago, IL. CAFLS staff manned a booth in the Education Pavilion to connect with Clemson alumni and promote the Packaging Science (PKSC) program. 20 or more PKSC students from a Creative Inquiry (CI) class this semester also designed, […]

October Newsletter 2018

The students have been working hard and have some cool stories to tell – here’s what you will find in our October newsletter! Packaging Science students design and build a data-driven booth for PackExpo International this month Graphic Comm grad student, Cat Bromels, shares her Finalnd work experience with printed electronics Coming soon: the P3 […]

P3 Forum for Alumni

Are you a Clemson alumnus working in packaging graphics or another related field? Then you’re not going to want to miss the second annual P3 Forum (People + Printing + Packaging) on October, 22-23 at Clemson University! This year’s event is centered around ‘Change.’ Change breeds opportunity. Opportunity for business to grow in new markets, for […]

Student talent, VR & more at PRINT 18

The Sonoco Institute and Clemson’s Graphic Communications (GC) department are participating in this year’s PRINT event in a BIG way, between manning trade show booths, leading educational sessions, engaging in networking opportunities and more. Clemson GC Assistant Professor, Dr. Erica Walker, is one of many representatives participating in this year’s event. “I always enjoy the opportunity […]

Clemson ‘explores the future’ at LabelExpo

This year, Sonoco Institute staff along with students and faculty from Clemson’s Graphic Communications (GC) department will attend LabelExpo Americas in Chicago, IL on September 25-27. LabelExpo is a massive gathering of label and package printing suppliers and brands who exhibit their products, demo their technologies, learn about global trends and network with industry experts. “We […]

September Newsletter 2018

Read more about the following headlines in our September newsletter! Read a Q&A excerpt with Clemson Graphic Communications student, Tom Koester, about his summer internship experience with DuPont Cyrel Learn more about Idealliance’s G7 Training & Certifications course held here in August Read about recent updates to the Institute’s Esko Packaging Supply Chain Computer Lab […]

Clemson student interns with DuPont

Clemson Graphic Communications student, Tom Koester, shares his summer internship experience Q: How did you learn about your summer internship? I first found out about the internship through Brad Gasque at DuPont Cyrel. He’s based in this area and visits the Sonoco Institute lab fairly frequently. He offered me advice on upcoming internships with his […]