The Sonoco Institute of Packaging Design and Graphics at Clemson University

Industry gains new tech insight at Future of Flexo event

On February 6-7 an inaugural Future of Flexo event was hosted at Clemson University’s Sonoco Institute of Packaging Design and Graphics, presented by OMET Americas. The event centered around “New Year, New Technology” and was sponsored by industry print suppliers Eaglewood Technologies, Siegwerk, Phoseon Technology, Nazdar Ink Technologies, DuPont, Techkon, DBT Coatings and Harper Corporation. The […]

Clemson ‘explores the future’ at LabelExpo

This year, Sonoco Institute staff along with students and faculty from Clemson’s Graphic Communications (GC) department will attend LabelExpo Americas in Chicago, IL on September 25-27. LabelExpo is a massive gathering of label and package printing suppliers and brands who exhibit their products, demo their technologies, learn about global trends and network with industry experts. “We […]