The Sonoco Institute of Packaging Design and Graphics at Clemson University

Clemson PRINT+PACK News – June

    Check out these June headlines! GC students accept positions with WiKoff Color and MacDermid Packaging Senior interns with Southwire The future of print training ‘On the road’ this summer Partner event: NAPIM summer ink course Coming soon: Flexo Foundations Seminar NOW HIRING! Project Coordinator, Advanced Print Lab             […]

Packaging senior interns with Southwire as Packaging Engineer

Clemson’s Packaging Science and Graphic Communications students are each required to participate in two co-op internships before they graduate. One Packaging Senior, Dillon Waters, is interning with a national family-owned business this summer called Southwire. Southwire provides half of all of the cable in the U.S. used to transmit and distribute electricity. A Packaging Science […]

Clemson PRINT+PACK News – May

    Check out these May headlines! Mimaki & Sonoco Institute Partner, Full-Color 3D Printing FTA FORUM & INFOFLEX 2019 Recap Clemson Students Win 48 HR Repack New Project: VR for Print NPIRI Summer Ink Technology Course Advanced Techniques in Flexo Workshop Industry Training Schedule                 Click here […]

Clemson PRINT+PACK News – April

    Check out these April headlines! Dustin Wills to lead Clemson University’s Sonoco FRESH Initiaitve Sonoco Institute to demo immersive, virtual pressroom at FTA’s INFOFLEX 2019 Clemson TAGA team wins Attendees’ Choice Award Packaging students complete 48 Hour Repack competition Institute partners establish GC student scholarships Partner event: SGIA Color Management Boot Camp Popular […]

Student awarded PACK EXPO Scholarship

It was announced at PACK EXPO International in Chicago last month, that one of Clemson’s Packaging Science students, Ray Cummings, has been awarded a $5,000 scholarship from PMMI (The Association for Packaging and Processing Technologies). PMMI held their annual PACK gives BACK™ networking reception at PACK EXPO International, a large trade show attended by Clemson University […]

CU packaging group returns from PackExpo International

Clemson University’s packaging division was highly involved in this year’s PackExpo International show at McCormick Place in Chicago, IL. CAFLS staff manned a booth in the Education Pavilion to connect with Clemson alumni and promote the Packaging Science (PKSC) program. 20 or more PKSC students from a Creative Inquiry (CI) class this semester also designed, […]

October Newsletter 2018

The students have been working hard and have some cool stories to tell – here’s what you will find in our October newsletter! Packaging Science students design and build a data-driven booth for PackExpo International this month Graphic Comm grad student, Cat Bromels, shares her Finalnd work experience with printed electronics Coming soon: the P3 […]