Month: November 2018

Read more about the following topics in our November newsletter! One Clemson packaging student was awarded a PACK EXPO scholarship #GivingTuesday is coming November 27 – find out how you can support a graduate student! In case you missed it… Clemson’s PACK EXPO experience Print trials and upcoming training courses at the Sonoco Institute A […]

It was announced at PACK EXPO International in Chicago last month, that one of Clemson’s Packaging Science students, Ray Cummings, has been awarded a $5,000 scholarship from PMMI (The Association for Packaging and Processing Technologies). PMMI held their annual PACK gives BACK™ networking reception at PACK EXPO International, a large trade show attended by Clemson University […]