Third Annual P3 Forum

November 4, 2019

By Kadence Baker

The week of October 21, Clemson University welcomed alumni and students to celebrate in homecoming festivities. Among these was the third annual P3 Forum put on by the Graphics Packaging Association and hosted at the Sonoco Institute of Packaging Design and Graphics, which took place October 21-22. During this, Graphic Communications (GC) and Packaging Science (PKSC) alums re/connected with current and former students around the topic of ‘sustainability.’ Alums from companies like Sonoco Recycling and Burt’s Bees attended to present their unique perspectives on sustainable packaging. 

Tajh Boyd shakes hand with a GC student.

Former Clemson quarterback Tajh Boyd shakes hand with a GC student.

P3 Forum kicked off the evening of October 21 with a social and networking event that was held at GC’s newly renovated gathering space in Godfrey Hall. This allowed GC and PKSC alums to network with industry professionals and current students in a casual setting. Alumni offered students advice on finding internships, jobs, and even the best places to live once they graduate. There was even a special appearance by former Clemson and NFL quarterback Tajh Boyd! 

The following day was built around a speaker series that highlighted new and innovative ways leaders in packaging and printing can create sustainable and eco-friendly products. The “Sustain + Ability” theme allowed for talks on ‘sustainable’ career moves, package recycling challenges, innovative packaging products and much more. 

A GC alumnae speaks to students about her post-collegiate experience.

A GC alumnus speaks to students about her post-collegiate experience.

P3 Forum concluded with a fun, Shark Tank-style breakout activity where attendees addressed sustainability challenges in groups, by presenting ideas for industry and academia to partner in moving the industry forward. 

Thank you to all alumni who attended this year’s event. If you missed out, keep an eye on to stay informed on the fourth annual P3 Forum and other industry events at Clemson University in 2020. 

For everyone involved in the Clemson Packaging Graphics Association, stay tuned for an exciting announcement about the expansion of the alumni group, including NEW leadership opportunities for both the committee and the 2020 forum. Contact Eric Ferguson for more information. 


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