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Clemson ‘explores the future’ at LabelExpo

September 12, 2018

This year, Sonoco Institute staff along with students and faculty from Clemson’s Graphic Communications (GC) department will attend LabelExpo Americas in Chicago, IL on September 25-27.

LabelExpo is a massive gathering of label and package printing suppliers and brands who exhibit their products, demo their technologies, learn about global trends and network with industry experts.

“We are looking forward to this year’s LabelExpo,” commented Kariahlyn Lindsey, project coordinator for the Institute’s Advanced Print Lab. “It is a great resource to learn about new technologies and opportunities that can be integrated into the Institute’s services, and then extended to our clients and students alike. This year, I am excited to reconnect with clients and aid Clemson students in making industry connections. I am also looking forward to networking with prospective clients and gaining insight into emerging technologies.”

Five Clemson students and Chip Tonkin, chair of GC and director of the Institute, are attending alongside Lindsey.

In addition to networking at the trade show, Clemson representatives will be attending OMET’s Join the Network Gala at the Rosemont Theater on September 26. This charity, networking and recognition event is designed to support OMET’s “Future of Flexo” education programs, of which Clemson University is involved. OMET and the Sonoco Institute partner in a variety of ways, especially surrounding OMET’s Varyflex 530 printing press placed in the Institute’s Advanced Print Lab to support research, education and innovation for the flexographic printing industry. Student pressroom assistants, hired by the Institute, are trained in-depth to operate the press, and industry professionals are invited to attend hands-on training courses in the print lab as well. Thanks to OMET, the Institute is also able to provide print testing services to the industry.

Look for a Clemson representative at LabelExpo. The team looks forward to making new connections and introducing student talent to industry leaders.



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